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    6~8.6G Half AMOLED Metal Mask Frame Cleaner
    – In-Line type Metal Mask Frame Cleaner
  • Features
  • · Dimension: 13,480 * 7,700 * 5,980
  • · Mode: Auto Mode
  • · Control: PLC
  • · Unterstützt 6G ~ 8,6G Halbe Größe
  • Specification
  • · Chemical : NMP, CS303, CS701
    New Concept Solution
  • · Bath Material : SUS304 EP
  • · Temp : RT~50℃
  • · No Use IPA
  • · Heißluft- und Entfeuchtungstrockneranwendung
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    6~8.6G Half AMOLED Metal Mask Frame Cleaner
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    AM OLED Metal Mask Cleaner (Open Mask) – Dipping Type
  • Features
  • · Dimension : 41,370 * 12,000 * 4,000
  • · Mode : Full Auto
  • · Control : PLC + PC
  • Specification
  • · Chemical: TWN-200, AGMG, IPA New Concept(Ungefährlich, ungefährlich)CS-700MC, CS701AC, CS-3100E
  • · Temp: 30 ~ 60℃
  • · Einschließlich Eingangs-/Ausgangssystem, automatischer Inspektionsmaschine und Trockner
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    AM OLED Metal Mask Cleaner (Open Mask) – In-line Type
  • Features
  • · Dimension: 15,000 * 5,000 * 2,800
  • · Mode: Full Auto
  • · Control: PLC
  • Specification
  • ·Config : Load → B/F#1 → Chemical → B/F#2 → Rinse#1,
    #2 → A/K(HOT) → Oven → Unload
  • · Supply Chemical Solution
  • · Type: In-line Conveyer Movement (Horizontal)
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    Si-Kathoden-Endreinigung / Loch- und Oberflächenätzen
  • Features
  • · Dimension: 41,370 * 12,000 * 4,000
  • · Mode: Full Auto
  • · Control: PLC + PC
  • Specification
  • · Config.: Load → Acid#1 → Rinse#1 →Acid#2
    → Rinse#2, #3 → Hot DIW →IR Oven Dry
    → Unload (depends on E.Q. process)
  • · Supply Chemical Solution
  • · TR moving / Agitation / Rolling /
    Bubbling / Ultrasonic
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    Ausrüstung für quadratische Nassstationen
  • Features
  • · Dimension: 1,320 * 1,200 * 2,220
    (depends on Target product size)
  • · Mode: Full Auto
  • · Control: PLC
  • Specification
  • · Config.: Load > Acid > IPA > Dry > Unload
    (depends on User’s process)
  • · Square Rotation / Minimieren Sie den Gerätebereich / Geeignet für den LAB-Einsatz
  • · TR moving / Agitation / Ultrasonic / CE-Zertifizierung
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    Wafer Cleaning Equipment
  • Features
  • · Mode: Full Auto Half Auto / Manual Mode
  • · Touch Screen Operation
  • · Real time display of system condition
  • · Certification: CE
  • Specification
  • · Chemical: HF, HNO3, NH4OH, H3PO4, BOE
  • · Bath Material: PTFE
  • · Chemical Mixing
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    Single Wafer Spin Etching & Cleaner (300mm)
  • Process Recipe
  • · H2SO4 PR Strip
  • · HF/BOE Etching Process
  • · Organic Strip Process
  • · CH3COOH+HF Etching
  • · SC-1 Clean Process
  • · DIW Rinse & Spin Dryer
  • Features
  • · 2 ~ 8 Heads System
  • · Chemical Etching & Clean Process
  • · Touch Screen Operation
  • · Real time display of system condition
  • Specification
  • · Chemical Mixing Features
  • · Uniformity: ≤ ±1%
  • · Spin : Servo Motor ≥ 3000rpm
  • · Chemical & DIW Nozzle
  • · X,Y,Z-Axis Transfer
  • · Transfer Robot Install
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    Quartz & Si Tube Cleaning Equipment
  • Features
  • · Mode: Auto mode
  • · Half Auto mode
  • · Touch Screen Operation
  • · Real time display of system condition
  • · S-Mark [KOSHA]
    SEMI-S2 [SGS]
  • Specification
  • · Tube Size: for 300㎜ Wafer
  • · Chemical: HF, HNO3
  • · Bath Material: PVDF
  • · Auto Bath Cover
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    Absperrplatten Reiniger
  • Features
  • · Dimension 15,000*3,000*4,300(H)
  • · Mode: Manual Mode
  • · Temp Control
  • · Ultraschall
  • Specification
  • · Chemical: RE-01, TWN100
  • · Bath Material: SUS316
  • · Temp: 30~60℃
  • · Transfer Robot
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    Chemical Delivery System
  • Features
  • · Mode: Auto & Half Auto mode
  • · Touch Screen Operation
  • · Real time display of system condition
  • · S-Mark [KOSHA]
  • Specification
  • · SC-1 Mixing Supply System
  • · Developer Mixing Supply System
  • · Organic Chemical Supply System
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    AIR JET MILL
Air Jet Mill
Milling Capacity 5~50kg/hr*
Milling Housing Meterial SUS 304
Mill Zone Circle Type : Zirconia Ceramic
Mill Zone Top Plate Zirconia Ceramic
Mill Zone Bottom Plate Zirconia Ceramic
Ejector Nozzle Material : SUS 304
Size : 7mm
Side nozzle Material : SUS 304
Size : 2.5mm * 6 way type
Input Press Gauge & Solenoid V/V Control
Using Press Air über 6kg/cm³
Sample Out Line Size 6s Ferrule – SUS304, Butterfly V/V 150A
Filtering Size 0.5μm

* Art und Menge der Probe kann je nach Partikelgröße variieren.

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    AIR JET MILL(Non Purge Type)
Air Jet Mill
Milling Capacity 100~500g/hr*
Milling Housing Meterial SUS 304
Mill Zone Circle Type : Zirconia Ceramic
Mill Zone Top Plate Zirconia Ceramic
Mill Zone Bottom Plate Zirconia Ceramic
Ejector Nozzle Material : SUS 304
Size : 6mm
Side nozzle Material : SUS 304
Size : 1.5mm * 5 way type
Input Press Gauge Control
Using Press Air über 6kg/cm³
Sample Out Line Size 1.5s Ferrule – SUS304, Glass Bottle & PTFE Cap

* Art und Menge der Probe kann je nach Partikelgröße variieren.

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    AIR JET MILL(N2 Purge Type)
Air Jet Mill
Milling Capacity 5~50kg/hr*
Milling Housing Meterial SUS 304
Mill Zone Circle Type : Zirconia Ceramic
Mill Zone Top Plate Zirconia Ceramic
Mill Zone Bottom Plate Zirconia Ceramic
Ejector Nozzle Material : SUS 304
Size : 6mm
Side nozzle Material : SUS 304
Size : 1.5mm * 5 way type
Input Press Gauge Control
Using Press Air über 6kg/cm³
Sample Out Line Size 1.5s Ferrule – SUS304, Glass Bottle & PTFE Cap
*Option N2 Purge box

* Art und Menge der Probe kann je nach Partikelgröße variieren.

Sie können die gesamte Palette der CSP-Entwicklungsprodukte sehen.